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PTN3342
High speed differential line receiver
Rev. 01 -- 05 January 2004 Product data
1. Description
The PTN3342 is a differential line receiver that implements the electrical characteristics of Low-Voltage Differential Signaling (LVDS). This device meets or exceeds the requirements of the ANSI TIA/EIA-644 Standard. LVDS is used to achieve higher data rates on commonly used media. LVDS overcomes the limitations of achievable slew rates and EMI restrictions of previous differential signaling techniques. The PTN3342 operates at a 3.3 volt supply level. Any of the four differential receivers provides a valid logical output state with a 100 mV differential input voltage within the input common-mode voltage range. The input common-mode voltage range allows 1 volt of ground potential difference between two LVDS nodes. The PTN3342 is identical to the PTN3332 but with the termination resistor integrated with the receiver. The intended application of this device is for point-to-point baseband transmission rates over a controlled impedance media of approximately 100 . The maximum rates and distance of data transfer are dependent upon the attenuation characteristics of the media selected and the noise coupling to the environment. The PTN3342 is designed to function over the full industrial temperature range of -40 C to +85 C.
2. Features
s s s s s s s s s Meets or exceeds the requirements of ANSI TIA/EIA-644 Standard Designed for signaling rates of up to 400 Mbps Differential input thresholds of 100 mV Power dissipation of 60 mW typical at 200 MHz Typical propagation delay of 2.6 ns Low Voltage TTL (LVTTL) logic output levels Pin compatible with AM26LS32 and SN65LVDS32 Open-circuit fail safe Termination resistors on chip.
3. Applications
s Low voltage, low EMI, high speed differential signal receiver s Point-to-point high speed data transmission s High performance switches and routers.
Philips Semiconductors
PTN3342
High speed differential line receiver
4. Ordering information
Table 1: Ordering information Package Name PTN3342DH PTN3342D TSSOP16 SO16 Description plastic thin shrink small outline package; 16 leads; body width 4.4 mm plastic small outline package; 16 leads; body width 3.9 mm Version SOT403-1 SOT109-1 Type number
5. Functional diagram division
PTN3342
G G 4 12
1A
2 LVDS 3 4Y
1B 2A
1 6 LVDS 5 4Y
2B 3A
7 10 LVDS 11 4Y
3B 4A
9 14 LVDS 13 4Y
4B
15
002aaa080
Resistors = 110 .
Fig 1. Functional diagram.
9397 750 08484
(c) Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Product data
Rev. 01 -- 05 January 2004
2 of 16
Philips Semiconductors
PTN3342
High speed differential line receiver
6. Pinning information
6.1 Pinning
1B 1A 1Y G 2Y 2A 2B GND
1 2 3
16 VCC 15 4B 14 4A
1B 1A 1Y G 2Y 2A 2B GND
1 2 3
16 VCC 15 4B 14 4A
PTN3342DH
PTN3342D
4 5 6 7 8
13 4Y 12 G 11 3Y 10 3A 9 3B
4 5 6 7 8
13 4Y 12 G 11 3Y 10 3A 9 3B
002aaa081
002aaa082
Fig 2. TSSOP16 pin configuration.
Fig 3. SO16 pin configuration.
6.2 Pin description
Table 2: Symbol 1B, 2B, 3B, 4B 1A, 2A, 3A, 4A 1Y, 2Y, 3Y, 4Y G GND G VCC Pin description Pin 1, 7, 9, 15 2, 6, 10, 14 3, 5, 11, 13 4 8 12 16 Description LVDS inverting input LVDS non-inverting input LVTTL output Enable (active-HIGH) Ground Enable (active-LOW) Supply
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Product data
Rev. 01 -- 05 January 2004
3 of 16
Philips Semiconductors
PTN3342
High speed differential line receiver
7. Functional description
7.1 Function table
Table 3: A, B VID 100 mV -100 mV < VID < 100 mV VID -100 mV X Open Function table Enables G H X H X H X L H X
[1]
Differential input
Output G X L X L X L H X L Y H H ? ? L L Z L L
H = HIGH level; L = LOW level; X = irrelevant; Z = high impedance; ? = indeterminate state.
8. Limiting values
Table 4: Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol VCC VI Tamb Tj Tstg Parameter supply voltage input voltage (enables and outputs) operating ambient temperature range operating junction temperature storage temperature range ESD
[1]
Min -0.5 -0.5 -40 -40 -65 >2
Max 4.0 VCC + 0.5 +85 +150 +150 -
Unit V V C C C kV
Values beyond absolute maximum ratings can cause the device to be prematurely damaged. Absolute maximum ratings are stress ratings only and functional device operation is not implied.
9. Recommended operating conditions
Table 5: Symbol VCC VIH VIL VID VIC Tamb Recommended operating conditions Parameter supply voltage HIGH-level input voltage LOW-level input voltage Magnitude of differential input voltage Common-mode input voltage Operating temperature range Min 3 2 - 0.1 VID/2 -40 Nom 3.3 - - - - - Max 3.6 - 0.8 0.6 2.4 - VID/2 +85 Unit V V V V V C
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Product data
Rev. 01 -- 05 January 2004
4 of 16
Philips Semiconductors
PTN3342
High speed differential line receiver
10. Static characteristics
Table 6: DC electrical characteristics Over recommended operating conditions, unless otherwise noted. Symbol Vrr+ Vrr- VOH VOL ICC II Parameter positive differential input voltage threshold negative differential input voltage threshold HIGH-level output voltage LOW-level output voltage supply current input current (A or B inputs). Input current measured with other input open. Power-off input current (A or B inputs) HIGH-level input current (G or G inputs) LOW-level input current (G or G inputs) High-impedance output current enabled, no load disabled VI = 0 V VI = 2.4 V VCC = 0 V; VI = 3.6 V VIH = 2 V VIL = 0.8 V VO = 0 V or VCC IOH = -8 mA IOH = -4 mA Conditions See Figure 4 and Table 8. Min - -100 2.4 2.8 - -2 -1.2 -10 88
All typical values are at Tamb = 25 C and VCC = 3.3 V.
Typ[1] - - - - - 10 0.25 -10 -3 6 - - -
Max 100 - - - 0.4 18 0.5 -20 - 20 10 10 10 132
Unit mV mV V V V mA mA A A A A A A
II(OFF) IIH IIL IOZ Z(t)
[1]
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(c) Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Product data
Rev. 01 -- 05 January 2004
5 of 16
Philips Semiconductors
PTN3342
High speed differential line receiver
11. Dynamic characteristics
Table 7: AC electrical characteristics Over recommended operating conditions, unless otherwise noted. Symbol tPLH tPHL tr tf tsk(p) tsk(o) tsk(p-p) tPZH tPZL tPHZ tPLZ Parameter propagation delay, LOW-to-HIGH level output propagation delay, HIGH-to-LOW level output output rise time (20 to 80%) output fall time (80 to 20%) pulse skew (tPHL - tPLH) channel-to-channel output skew part-to-part skew propagation delay, high-impedance to HIGH-level output propagation delay, high-impedance to LOW-level output propagation delay, HIGH-level to high-impedance output propagation delay, LOW-level to high-impedance output See Figure 6.
[2] [3]
Conditions CL = 10 pF See Figure 5.
Min 1.3 1.3 - - - - - - - - -
Typ[1] 2.6 2.5 0.6 0.7 - 0.1 - 8 3 6.5 5.5
Max 6 6 - - 0.4 0.3 1 12 12 12 12
Unit ns ns ns ns ns ns ns ns ns ns ns
[1] [2] [3]
All typical values are at Tamb = 25 C, and VCC = 3.3 V. tsk(o) is the skew between specified outputs of a single device with all driving inputs connected together and the outputs switching in the same direction while driving identical specified loads. tsk(p-p) is the magnitude of the difference in propagation delay times between any specified terminals of two devices when both devices operate with the same supply voltages, same temperature, and have identical packages and test circuits.
9397 750 08484
(c) Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Product data
Rev. 01 -- 05 January 2004
6 of 16
Philips Semiconductors
PTN3342
High speed differential line receiver
12. Test figures
A VID Y B
(VIA + V IB) 2
VIC
VIA VIB
VO
002aaa029
Fig 4. Voltage definitions. Table 8: Receiver minimum and maximum input threshold test voltages Resulting differential input voltage VID 100 mV -100 mV 100 mV -100 mV 100 mV -100 mV 600 mV -600 mV 600 mV -600 mV 600 mV -600 mV Resulting common-mode input voltage VIC 1.2 V 1.2 V 2.35 V 2.35 V 0.05 V 0.05 V 1.2 V 1.2 V 2.1 V 2.1 V 0.3 V 0.3 V
Applied voltages VIA 1.25 V 1.15 V 2.4 V 2.3 V 0.1 V 0V 1.5 V 0.9 V 2.4 V 1.8 V 0.6 V 0V VIB 1.15 V 1.25 V 2.3 V 2.4 V 0V 0.1 V 0.9 V 1.5 V 1.8 V 2.4 V 0V 0.6 V
9397 750 08484
(c) Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Product data
Rev. 01 -- 05 January 2004
7 of 16
Philips Semiconductors
PTN3342
High speed differential line receiver
A VID Y B
VIA VIB
CL = 10 pF
VO
VIA
1.4 V
VIB
1.0 V
0.4 V VID 0V -0.4 V tPHL 80% VO 20% tf 20% tr tPLH 80% VOH 1.4 V VOL
002aaa030
Fig 5. Timing test circuit and waveforms.
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(c) Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Product data
Rev. 01 -- 05 January 2004
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Philips Semiconductors
PTN3342
High speed differential line receiver
A 1.2 V G G CL 10 pF VO B R 500 VTEST
VTEST A
2.5 V 1.0 V 2.0 V
G
1.4 V 0.8 V 2.0 V
G tPLZ tPZL tPLZ
1.4 V 0.8 V
tPZL
2.5 V Y 1.4 V VOL + 0.5 V VOL
VTEST A
0V 1.4 V 2.0 V
G
1.4 V 0.8 V 2.0 V
G tPZH tPHZ tPZH tPHZ
1.4 V 0.8 V
VOH VOH - 0.5 V Y 1.4 V 0V
002aaa031
Fig 6. Enable/disable time test circuit and waveforms.
9397 750 08484
(c) Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Product data
Rev. 01 -- 05 January 2004
9 of 16
Philips Semiconductors
PTN3342
High speed differential line receiver
13. Package outline
TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm SOT403-1
D
E
A
X
c y HE vMA
Z
16
9
Q A2 pin 1 index A1 Lp L (A 3) A
1
e bp
8
wM detail X
0
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max. 1.1 A1 0.15 0.05 A2 0.95 0.80 A3 0.25 bp 0.30 0.19 c 0.2 0.1 D (1) 5.1 4.9 E (2) 4.5 4.3 e 0.65 HE 6.6 6.2 L 1 Lp 0.75 0.50 Q 0.4 0.3 v 0.2 w 0.13 y 0.1 Z (1) 0.40 0.06 8 0o
o
Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT403-1 REFERENCES IEC JEDEC MO-153 JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-18
Fig 7. TSSOP16 package outline (SOT403-1).
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Product data
Rev. 01 -- 05 January 2004
10 of 16
Philips Semiconductors
PTN3342
High speed differential line receiver
SO16: plastic small outline package; 16 leads; body width 3.9 mm
SOT109-1
D
E
A X
c y HE vMA
Z 16 9
Q A2 pin 1 index Lp 1 e bp 8 wM L detail X A1 (A 3) A
0
2.5 scale
5 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 1.75 A1 0.25 0.10 A2 1.45 1.25 A3 0.25 0.01 bp 0.49 0.36 c 0.25 0.19 D (1) 10.0 9.8 E (1) 4.0 3.8 0.16 0.15 e 1.27 0.05 HE 6.2 5.8 L 1.05 Lp 1.0 0.4 0.039 0.016 Q 0.7 0.6 0.028 0.020 v 0.25 0.01 w 0.25 0.01 y 0.1 Z (1) 0.7 0.3
0.010 0.057 0.069 0.004 0.049
0.019 0.0100 0.39 0.014 0.0075 0.38
0.244 0.041 0.228
0.028 0.004 0.012
8 0o
o
Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. OUTLINE VERSION SOT109-1 REFERENCES IEC 076E07 JEDEC MS-012 JEITA EUROPEAN PROJECTION
ISSUE DATE 99-12-27 03-02-19
Fig 8. SO16 package outline (SOT109-1).
9397 750 08484 (c) Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Product data
Rev. 01 -- 05 January 2004
11 of 16
Philips Semiconductors
PTN3342
High speed differential line receiver
14. Soldering
14.1 Introduction to soldering surface mount packages
This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit Packages (document order number 9398 652 90011). There is no soldering method that is ideal for all IC packages. Wave soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch SMDs. In these situations reflow soldering is recommended. In these situations reflow soldering is recommended.
14.2 Reflow soldering
Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Driven by legislation and environmental forces the worldwide use of lead-free solder pastes is increasing. Several methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. Typical reflow peak temperatures range from 215 to 270 C depending on solder paste material. The top-surface temperature of the packages should preferably be kept:
* below 225 C (SnPb process) or below 245 C (Pb-free process)
- for all BGA, HTSSON..T and SSOP..T packages - for packages with a thickness 2.5 mm - for packages with a thickness < 2.5 mm and a volume 350 mm3 so called thick/large packages.
* below 240 C (SnPb process) or below 260 C (Pb-free process) for packages with
a thickness < 2.5 mm and a volume < 350 mm3 so called small/thin packages. Moisture sensitivity precautions, as indicated on packing, must be respected at all times.
14.3 Wave soldering
Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed. If wave soldering is used the following conditions must be observed for optimal results:
* Use a double-wave soldering method comprising a turbulent wave with high
upward pressure followed by a smooth laminar wave.
9397 750 08484 (c) Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Product data
Rev. 01 -- 05 January 2004
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Philips Semiconductors
PTN3342
High speed differential line receiver
* For packages with leads on two sides and a pitch (e):
- larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; - smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end.
* For packages with leads on four sides, the footprint must be placed at a 45 angle
to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time of the leads in the wave ranges from 3 to 4 seconds at 250 C or 265 C, depending on solder material applied, SnPb or Pb-free respectively. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications.
14.4 Manual soldering
Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C.
14.5 Package related soldering information
Table 9: Package[1] BGA, HTSSON..T[3], LBGA, LFBGA, SQFP, SSOP..T[3], TFBGA, USON, VFBGA Suitability of surface mount IC packages for wave and reflow soldering methods Soldering method Wave not suitable Reflow[2] suitable suitable
DHVQFN, HBCC, HBGA, HLQFP, HSO, HSOP, not suitable[4] HSQFP, HSSON, HTQFP, HTSSOP, HVQFN, HVSON, SMS PLCC[5], SO, SOJ LQFP, QFP, TQFP SSOP, TSSOP, VSO, VSSOP CWQCCN..L[8],
[1] [2]
suitable not recommended[5][6] not recommended[7] WQCCN..L[8] not suitable
suitable suitable suitable not suitable
PMFP[9],
For more detailed information on the BGA packages refer to the (LF)BGA Application Note (AN01026); order a copy from your Philips Semiconductors sales office. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods.
(c) Koninklijke Philips Electronics N.V. 2004. All rights reserved.
9397 750 08484
Product data
Rev. 01 -- 05 January 2004
13 of 16
Philips Semiconductors
PTN3342
High speed differential line receiver
These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account be processed through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature exceeding 217 C 10 C measured in the atmosphere of the reflow oven. The package body peak temperature must be kept as low as possible. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side, the solder might be deposited on the heatsink surface. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. Wave soldering is suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by using a hot bar soldering process. The appropriate soldering profile can be provided on request. Hot bar soldering or manual soldering is suitable for PMFP packages.
[3]
[4]
[5] [6] [7] [8]
[9]
15. Revision history
Table 10: Rev Date 01 20040105 Revision history CPCN Description Product data (9397 750 08484). ECN 853-2444 A14997 of 15 December 2003.
9397 750 08484
(c) Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Product data
Rev. 01 -- 05 January 2004
14 of 16
Philips Semiconductors
PTN3342
High speed differential line receiver
16. Data sheet status
Level I II Data sheet status[1] Objective data Preliminary data Product status[2][3] Development Qualification Definition This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN).
III
Product data
Production
[1] [2] [3]
Please consult the most recently issued data sheet before initiating or completing a design. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
17. Definitions
Short-form specification -- The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition -- Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information -- Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification.
18. Disclaimers
Life support -- These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes -- Philips Semiconductors reserves the right to make changes in the products - including circuits, standard cells, and/or software - described or contained herein in order to improve design and/or performance. When the product is in full production (status `Production'), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.
Contact information
For additional information, please visit http://www.semiconductors.philips.com. For sales office addresses, send e-mail to: sales.addresses@www.semiconductors.philips.com.
9397 750 08484
Fax: +31 40 27 24825
(c) Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Product data
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15 of 16
Philips Semiconductors
PTN3342
High speed differential line receiver
Contents
1 2 3 4 5 6 6.1 6.2 7 7.1 8 9 10 11 12 13 14 14.1 14.2 14.3 14.4 14.5 15 16 17 18 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Functional diagram division . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 Functional description . . . . . . . . . . . . . . . . . . . 4 Function table . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4 Recommended operating conditions. . . . . . . . 4 Static characteristics. . . . . . . . . . . . . . . . . . . . . 5 Dynamic characteristics . . . . . . . . . . . . . . . . . . 6 Test figures. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 10 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Introduction to soldering surface mount packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 12 Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 12 Manual soldering . . . . . . . . . . . . . . . . . . . . . . 13 Package related soldering information . . . . . . 13 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 14 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 15 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
(c) Koninklijke Philips Electronics N.V. 2004. Printed in the U.S.A.
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Date of release: 05 January 2004 Document order number: 9397 750 08484

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